event promotion

undersea defence technology

26 - 28 June 2018, Glasgow, Scotland

Undersea Defence Technology (UDT) 2018 will take place in Glasgow, Scotland from 26 to 28 June. UDT strives towards and continues to deliver a platform for the subsea community to gather and discuss the industry’s most pressing questions, prominent technologies and innovative solutions. 


The undersea environment is one of the harshest on earth and the technological complexities of operating in this environment mean it is essential to provide a forum for the entire community to share their knowledge. 


UDT will see international companies encompassing prime contractors, systems integrators, service providers and small & medium enterprises meet and network with over 1,400 industry influencers, government decision makers and senior military officials.


Babcock Innovation Zone


The Babcock Innovation Zone, a bespoke exhibition space, will be available for startups and small businesses to promote their contemporary technologies, innovations and industry solutions at the international event and interested parties are being asked to get in touch.    

 
Babcock through a common interest with UDT, is providing a platform into the undersea defence market for pioneering industry contributors. The Babcock Innovation Zone is the ideal platform for collaborations from business and academia working on the latest technology, or small companies with a new product or service, to present their bespoke solutions to the enterprise. In parallel an area has been created to allow researchers to present their work through a poster and discuss it in person at timetabled and promoted times.


The organisers are looking to provide a stage for systems integrators, service providers and small enterprises in a way that has not been done before. At the heart of the Babcock Innovation Zone is an ethos to allow the smallest of companies into a uniquely competitive market – where many innovative and cutting-edge solutions can be difficult to uncover otherwise.


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